A. To reduce Particle impact at production process

The flip chip bonding is the most critical process to RFID product quality, and critical issues to bonding process include bonding position accuracy, bonding force, curing temperature & time, and the last and the most important is particle issue. Favite has equipped all RFID production facilities with full cover and class 10K cleanroom to eliminate the impact of particle issue to improve the production yield.

B. To do real-time defect detection by Automatic Optical Inspection (AOI) Equipment

Favite has installed Automatic Optical Inspection function to the production equipments to ensure all the defect with size larger than 30um to be detected in real time, especially the defect detection in the printing and plating process, and to ensure the production quality is good and increase yield.

C. To do real-time final product test by RFID Reader

For final product such Inlay and Tag, Favite has equipped with RFID reader to do product performance testing. In addition to Go/No Go testing, the product performance such as read range will also be tested.